Hivatkozási szám

MSZ EN IEC 60749-22-2:2026

Dokumentumazonosító

187984

Cím

Félvezető eszközök. Mechanikai és klimatikus vizsgálati módszerek. 22-2. rész: Kötési szilárdság. A huzalkötés nyíróvizsgálati módszerei (IEC 60749-22-2:2025)

Angol cím

Semiconductor devices. Mechanical and climatic test methods. Part 22-2: Bond strength. Wire bond shear test methods (IEC 60749-22-2:2025)

Alkalmazási terület

This part of IEC 60749 establishes a means for determining the strength of a ball bond to a die or package bonding surface and can be performed on pre-encapsulation or post-encapsulation devices. This measure of bond strength is extremely important in determining two features: a) the integrity of the metallurgical bond which has been formed, and b) the quality of ball bonds to die or package bonding surfaces. This test method covers thermosonic (ball) bonds made with small diameter wire from 15 µm to 76 µm (0,000 6" to 0,003"). This test method can only be used when the bonds are large enough to allow for proper contact with the shear test chisel and when there are no adjacent interfering structures that would hinder the movement of the chisel. For consistent shear results the ball height will be at least 4,0 µm (0,000 6 ") for ball bonds, which is the current state of the art for bond shear test equipment at the time of this revision. This test method can also be used on ball bonds that have had their wire removed and on to which a second bond wire (typically a stitch bond) is placed. This is known as "stitch on ball" and "reverse bonding". See Annex A for additional information. The wire bond shear test is destructive. It is appropriate for use in process development, process control, or quality assurance, or both. This test method can be used on ultrasonic (wedge) bonds, however its use has not been shown to be a consistent indicator of bond integrity. See Annex B for information on performing shear testing on wedge bonds. This test method does not include bond strength testing using wire bond pull testing. Wire bond pull testing is described in IEC 60749-22-1.

ICS

31.080.01 Félvezető eszközök általában

Műszaki Bizottság

A szabvány nyelve

angol

Az érvényesség kezdete

2026-06-01

Forrás

idt IEC 60749-22-2:2025; idt EN IEC 60749-22-2:2026

Előd

MSZ EN 60749-22:2003

Utód

Módosítás

Kiegészítő információk

SZK-közlemények

Kapcsolódó európai jogszabály

A szabvány

kapható formátuma

Papír ,
PDF (letöltés) (a fájl mérete: 6994341) ,

oldalszáma

40 oldal; T kategória

Felár

IEC: 5%

ára

Nettó: 20960 Ft
Nettó (felárral): 22008.00 Ft
Bruttó:
Papír formátum esetén (25% nyomdai költséggel, 5% Áfával): 28886 Ft
PDF (letöltés) formátum esetén ( 27% Áfával): 27950 Ft